The thermal properties of diamond grinding wheel abrasives mainly include thermal expansion, thermal conductivity, melting point, specific heat, and thermal stability.(1) Thermal expansibilityOften, only the linear expansion coefficient of diamond grinding wheel abrasives is measured. The coefficient of linear expansion refers to the relative length change that occurs in a fixed direction for each rise in temperature of an object.The measurement of the linear expansion coefficient of diamond grinding wheel abrasives is a test that involves adding a certain proportion of the binder to the granular diamond grinding wheel abrasive and pressing it into a specified shapeThe rod is used to measure the linear expansion of the sample using a thermal dilatometer, and then the linear expansion coefficient of the diamond grinding wheel abrasive is calculated based on the sand to sand ratio.The linear expansion coefficient of silicon carbide can be taken as a=4.4XlO-6.K&# 39; in the range of 250 ° C to 1400 ° C; The abrasive of corundum diamond grinding wheel can be taken as a=(7-8) X1 (r6*1 ^ 1. The purpose of measuring the linear expansion coefficient of diamond grinding wheel abrasives is to selectTake a bond that is similar to the linear expansion coefficient of diamond grinding wheel abrasive and has a similar trend in the expansion curve to avoid cracks in the grinding tool during heating and cooling, ensuring sufficient strength of the grinding tool.(2) Thermal conductivity

The thermal conductivity indicates the speed of heat transfer of an object during sudden cooling or heating. Can the thermal conductivity A of silicon carbide be taken as 6.28? 9.63W.m-1.K-1. Corundum can be taken as 1.570241W. m-1? K1. The thermal conductivity is particularly important for refractory materials. Products with high thermal conductivity have a small temperature difference between the inner and outer layers, which correspondingly reduces the thermal stress between the inner and outer layers, which is beneficial for improvingHigh thermal shock stability. Regarding the manufacturing of grinding tools, selecting diamond grinding wheel abrasives with high thermal conductivity is beneficial for heat dissipation during grinding.(3) Melting pointThe melting point is the melting temperature of a crystal. The melting point of a-AU] 3 is 2050 ° C. Is the melting point of brown corundum diamond grinding wheel abrasive at 1850? Within the range of 2050 ° C. The melting point of silicon carbide is related to the atmosphere, at 2200? Within the range of 2700 ° C.Article source: Diamond wheel manufacturerhttp://www.jm-nanhua.com/